Innovative New Energy Circuit Board Manufacturer in China Video

Name: Innovative New Energy Circuit Board Manufacturer in China
Uploaded: 2024-05-27T19:08:16+08:00
Description: Specifications: Layers: 4 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 46*46mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Fi

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$2.50

1,000+ Pieces US$2.45

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 100*220mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment HASL

Product Description

Specifications: Layers: 4 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 46*46mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Reliable PCB with Keypad Comparison

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Transaction Info
	Quick View Innovative New Energy Circuit Board Manufacturer in China Contact Now	Quick View Communication Module GPRS HDI 4layer Em825 Enig OSP PCB Contact Now	Quick View Telecom Mobile Phone 6layer HDI Em825 Immersion Gold PCB Contact Now	Quick View 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module Contact Now	Quick View Wireless Router HDI 8layer It-180A Enig PCB High Density Interconnect Contact Now
Price	US $ 2.45-2.50/ Piece	US $ 0.22-1.15/ Piece	US $ 2.36-7.89/ Piece	US $ 2.54-8.12/ Piece	US $ 3.15-8.98/ Piece
Min Order	10 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: HASL;	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 0.6mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold + OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer HDI PCB; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Feature: Half of Holes;	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer HDI PCB 2+N+2; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 0.8/1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer HDI PCB 2+N+2; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: Multilayer Rigid PCB; Material: Epoxy Paper Laminate; Flame Retardant Properties: V0; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer HDI PCB 2+N+2; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall: 20um Cu;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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