| Specification |
Application: Aerospace, Electronics, Refractory, Industrial Ceramic;
Type: Ceramic Tubes;
Specific Resistivity: 1018;
Poisson Ratio: 0.25;
Thermal Conductivity: 15~20;
Processing Service: Moulding;
Density: 3.2g/cm3;
Crushing Load Ratio (25ºC): 35~45%;
Flexural Strength: 700~800MPa;
Fracture Toughness: 6.0~7.0;
Hardness(Hv): 1600 - 1800MPa;
Coefficient of Linear Expansion: 3.0~3.2;
Modulus of Elasticity: 300~320gpa;
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Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Material: Hot Pressed Boron Nitride;
Density: 1.5-2.9 g/cm3;
Color: White, Light Grey, Dark Grey;
Thermal Conductivity: 30-85 W/M.K;
Max Working Temperature (in Air): 1000 C;
Max Working Temperature (in Vacuum): 1800 C;
Max Working Temperature (in Inert Gas): 2100 C;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plate, Ceramic Plates;
Name: Aluminum Nitride Aln Hot Pressing Ceramic Plate;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Export Experience: Semiconductor Aln Ceramic Parts;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plates;
Name: Aluminum Nitride Aln Ceramic Semiconductor Compone;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plates;
Name: Aluminum Nitride Ceramic Aln Material;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Export Experience: Semiconductor Aln Ceramic Parts;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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