| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Nelco Arlon Isola;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Al;
Application: PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Hfi;
Size: 1020*2040;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Materials: Fr-4, Cem1, Cem3, Aluminum, Copper;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irre;
Qualified: Ipc-a-610 Class 2;
Thick Copper: 18um-210um(6oz);
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Service: OEM/ODM, EMS;
Profiling Punching: Routing,V-Cut, Beveling;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
OEM/ODM/EMS: PCBA, PCBA Aassembly: SMT & Pth & BGA;
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