| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Nelco Arlon Isola;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Huishine;
Product Name: Control Board PCBA for Air Cooler;
Size: as Customers' Request;
Functions: Control The Fireplace;
Color: Customized Request;
Certificationn: RoHS, CCC, ISO, Ts 16949;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Huishine;
Product Name: Control Board PCBA for Air Cooler;
Size: as Customers' Request;
Functions: Control The Fireplace;
Color: Customized Request;
Certificationn: RoHS, CCC, ISO, Ts 16949;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
Application: Home Appliances;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: HS-PCBA;
Product Name: Milk Frother PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
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