What is Flexible Multilayer PCB Assembly for Home Appliances

Name: Flexible Multilayer PCB Assembly for Home Appliances
Uploaded: 2023-12-25T17:45:13+08:00
Description: Company Profile ZINPON PCB is a leading manufacturer of high-density multi-layer PCBs with over ten years of experience. Our products are highly regarded worldwide, with 60% of them being sold to

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Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Nelco Arlon Isola
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

Company Profile ZINPON PCB is a leading manufacturer of high-density multi-layer PCBs with over ten years of experience. Our products are highly regarded worldwide, with 60% of them being sold to Europe, America, Japan, and other Asia-Pacific countries. We specialize in providing PCB prototype ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Flexible PCB Assembly Comparison

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Transaction Info
	Quick View Flexible Multilayer PCB Assembly for Home Appliances Contact Now	Quick View IC Substrate Csp High Density Build-up Structure Circuit Board PCB for Smart Phones Computers Contact Now	High Layout Density PCB with High I/O Count and Short Interconnects Contact Now	Quick View Soft Au Hard Au Plate Overall Substrate Thickness Down to 0.1mm PCB Contact Now	Quick View High Circuit Density Design Multilayer PCB for Microprocessors Controller Asics DTV Contact Now
Price	US $ 1.00-10.00/ Square Meter	US $ 0.079-0.38/ Piece	US $ 0.087-0.586/ Piece	US $ 0.083-0.59/ Piece	US $ 0.082-0.65/ Piece
Min Order	1 Square Meters	1000 Pieces	1000 Pieces	1000 Pieces	1000 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Nelco Arlon Isola; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: 90um for MP, 80um Under Development; Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm; Fine Line/Space: Msap 20/20um;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: 90um for MP, 80um Under Development; Fine Line/Space: 15/15um; Other: Bump Pitch Down to 100 Um;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: Down to 0.1mm; Core Thickness: 40/35um; Other: Liquid or Dry film Solder Mask;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: Down to 0.1mm; Line/Space: 20/20um; Other: Impedance Control for Critical Signal Traces;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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