| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Testing: PCB: Ict Testing and Flying Probe Testing;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
PCB Materials: Fr4;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Tg: Tg170;
IC: Qfn;
IC Type: BGA;
SMT: 01005;
PCBA Testing: Function Testing 100%;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Testing: PCB: Ict Testing and Flying Probe Testing;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
PCB Materials: Fr4;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Tg: Tg170;
IC: Qfn;
IC Type: BGA;
SMT: 01005;
PCBA Testing: Function Testing 100%;
|
Structure: Standard;
Dielectric: Standard;
Material: Standard;
Application: Consumer Electronics;
Flame Retardant Properties: Standard;
Processing Technology: Standard;
Production Process: Standard;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ckmcu;
Sku: 29029;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
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