Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, 100% E-Test, Aoi, RoHS;
MOQ: No MOQ, 1PCS Is Okay;
Stock Material: Shengyi, Pi, Alu, Rogers, Arlon, Taconic, Isola;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 8L;
Board Thickness: 1.57mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 4L;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.38mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 10L;
Board Thickness: 1.57mm;
Copper Thickness: 1.5oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.25mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 16L;
Board Thickness: 1.5mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.5mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
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