Golden Finger PCB Intelligent Control HDI Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-99.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Model FR-4
  • Transport Package Vacuum Packing
  • Origin Guangdong, China
  • Application High-Tech Products
  • Solder Mask Color Green
  • Silkscreen Color White
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Product Description 1 Layer ...

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Transaction Info
Price US $ 0.50-99.00/ Piece US $ 7.50-8.50/ Piece US $ 7.50-8.50/ Piece US $ 7.50-8.50/ Piece US $ 7.50-8.50/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms L/C, T/T, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO
Management System Certification ISO 9001, QC 080000, BRC, EICC, ISO 50001, PAS 28000, FSC - - - -
Trade Capacity
Export Markets - - - - -
Annual Export Revenue US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM - - - -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Application: High-Tech Products;
Solder Mask Color: Green;
Silkscreen Color: White;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Supplier Name

Shenzhen Zhongyuan Circuit Industry Co., Ltd

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier