1,105 Thermal Potting Compound
results from23 suppliers
Low Viscosity Excellent Heat Dissipation Silicone Thermal Conductive Potting Compound for New Energy Battery Pack Electronic Components
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
PCB High Thermal Conductivity Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
High Thermal Conductivity EV Battery Silicone Rubber Potting Compound
- Application: Automobile, Woodworking
- Material: Silicone
- Main Agent Composition: Inorganic Adhesive Material
- Characteristic: Thermal Conductive
- Promoter Composition: Curing Agent
- Composition: Inorganic Material
Excellent Thermal Conductivity Prevent Overheating Components and Motors Compound Potting
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Excellent Thermal Conductivity and Aging Resistance Vs-Tp2001 Fixation Potting and Encapsulation Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
PCB Application 1.0 Thermal Conductivity Silicone Material Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
1: 1 Mixing 1.0W 2.0W Silicone Rubber Thermal Conductive Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
PCB Application Two Component Thermal Conductive Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Vs-Tp2001 2.0 Thermal Conductivity Silicone Thermally Conductive Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
2.0 W/M K Thermal Conductivity PCB Thermal Conductive Silicone Gel Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Two-Component Material High Thermal Conductivity Potting Compound
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 35 Shore a
Wholesale PCB Protection Thermal Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Heat-Resistant Against Moisture High Thermal Conductivity Epoxy Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Permanent Protective Solution Two Components Thermal Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Vs-Tp0501 Two-Component Material High Thermal Conductivity Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
High Temperature Resistant Thermal Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Electronic Industrial Silicone Rubber Thermal Glue Sealant Adhesive 1001 Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Vs-Tp1501 Heat Conductive Potting Compound Silicone Compound Thermal Conductive Grease Heatsink
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Double Component 10: 1 Silicone Thermal Electronic Condensation Potting Compound for Power Supply and Power Module
- Type: Silicone Sealant
- Seal Tape Kind: Adhesives
- Seal Tape Usage: Engineering, Solar Module, Solar Panels
- Material: Composite Materials
- State: Fluid
- Mildew Proof: Mildew Proof
1: 1 Two Component Thermal Conductive Silicone Electronic Potting Compound
- Type: Silicone Sealant
- Seal Tape Kind: Adhesives
- Seal Tape Usage: Engineering, Solar Module, Solar Panels
- Material: Composite Materials
- State: Fluid
- Mildew Proof: Mildew Proof
Vs-Tp1501 Excellent Mechanical Properties Automotive Electronic Devices Thermal Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Low Viscosity Excluding Moisture and Corrosive Agents Electronics Stanility Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Remain Integral Part of The Unit Protect The Electronic Assembly Compound Potting
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
High-Performance Electronics Potting Materials Heat Dissipation Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Vs-Tp1501 PCB Application Silicone Thermally Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Thoughtful Instruction Printed Circuit Boards Potting Compound Thermally Conductive
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Protective Barrier Around High-Heat Electrical Appliances Aging Resistance Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
High Hardness Shore PCB Electronics Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
High Temperature 1001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Good Adhesion to Metals Plastics Protect Sensitive Components Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Industrial-Grade Corrosion Protection Electronics Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
High Temperature Vs-Tp0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Flexible Enhanced Mechanical Strength Vibration Resistance Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
High Temperature Vs-Tp1501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Precision Bonding Chemical Protection Potting Compound No Harm environment
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Silver Loaded Electrically and Thermally Liquid Conductive 1001 Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Durable Prevalent for Automotive Aerospace Electronic Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Thermally Conductive Epoxy Electrically Insulating Adhesive 1001 Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
High Temperature Vs-Tp2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing