1,339 Thermal Potting Compound
results from32 suppliers
Ultrafine Fused Silica Powder -270f
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Two Component Thermally Conductive Flame Retardant UL 94 V0 Polyurethane Silicone Compound for Electronics Sensors
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Radiation Resistant Fused Quartz Grains
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Reduced Weight Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Thermal Insulation Fused Quartz Powder
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Yellow Transparent 2-Part PU Potting Compound for Home Appliances PCB Sealing
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Fused Silica Sand 4-10 Mesh
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Chemical-Resistant High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Fused Quartz Sand for Semiconductor Industry
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Hot Selling Products for Electronic Assemblies High Electrical Insulation Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Good Adhesion 1001 Both Metals and Plastics Connection Thermal Conductive Copper Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Thermal Conductive Electronic Silicone Potting Compound Two Part LED PCB Silicone Rubber Potting Compound
- Raw Material: Synthetic Rubber
- Material: Silicone Rubber
- Appearance: Liquid
- Form: Liquid Rubber
- Item: RTV 160
- Color: a: Grey B: White
5: 1 Black High Thermal Electronics Ab Epoxy Potting Material Adhesive
- CAS No.: None
- Formula: None
- EINECS: 230-391-5
- Bonding Function: Structural Adhesive
- Morphology: Water Emulsion
- Application: Fiber & Garment
Two Parts Thermal High-Temperature Resistance Epoxy Potting Adhesive
- CAS No.: 7085-85-0
- EINECS: 230-391-5
- Bonding Function: Instant Adhesive
- Morphology: Solvent
- Application: Automobile, Construction, Woodworking, Fiber & Garment
- Material: Epoxy
Two Component Thermal Conductivity High-Temperature Resistance Epoxy Potting Adhesive
- Bonding Function: Instant Adhesive
- Morphology: Water Emulsion
- Application: Automobile, Woodworking, Footwear & Leather
- Material: Silicone
- Classification: Room Curing
- Main Agent Composition: Epoxy
Thermal Conductive Two-Component Electronic Potting RTV Silicone for LED Encapsulating
- Material: Silicone Rubber
- Appearance: Liquid
- Item: Mcsil-E160
- Color: Grey
- Mixing Ratio: 1:1
- Working Time: 30 Mins
Long-Lasting Insulation Shock Resistance Electronic Potting Compound Epoxy Gel
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Silicone Liquid 1001 Potting Compound Thermally Conductive Black Epoxy Encapsulating
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Boron Nitride Powder Potting Compound Filler
- CAS No.: 10043-11-5
- Formula: Bn
- EINECS: 233-136-6
- Certification: REACH
- Environmental Protection: Yes
- Function: Heat Resistance, Thermal Conductive
28-30um 233-136-6 Hbn Boron Nitride Powder
- CAS No.: 10043-11-5
- Formula: Bn
- EINECS: 233-136-6
- Certification: REACH
- Environmental Protection: Yes
- Function: Heat Resistance, Thermal Conductive
Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Color-Tunable
- Appearance: Black Viscous Liquid (Color-Tunable)
- Density: 1.70-1.85
- Viscosity: 1000-3500
- Glass Transition Temperature: 45-75
Electrical Epoxy Potting Compound for Sensor
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Black
- Appearance: Black Viscous Liquid
- Density: 1.84-1.90
- Viscosity: 40000-80000
- Glass Transition Temperature: Greater Than O R Equal to 160
Room Curing Polyurethane Compound Potting Bepu 6601 Two-Component Sealing
- CAS No.: 9009-54-5
- EINECS: 230-391-5
- Application: Motor, Automotive Electronics, Power Tools, Reacto
- Material: Polyurethane
- Classification: Room Curing
- Packing: a: 20L/Drum B: 5L/Can
Professional Spherical Aluminum Oxide Powder for Thermal Interface Materials Epoxy Molding Compounds
- CAS No.: 1344-28-1
- Formula: Al2O3
- EINECS: 215-691-6
- Material: Al2O3
- Structure Feature: White Powder
- Type: Chemical
High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit Meters and Pump
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Waterproof, Conductive Silicone Potting Compound for Electronics
- Application: Insulators
- Type: Liquid
- Chemistry: Hybrid Insulation
- Material: Silicone
- Thermal Rating: 250 250
- Classification: Hybrid Insulation Materials
Electronic Potting Silicone Rubber Compounds for PCB
- Raw Material: Synthetic Rubber
- Material: Silicone Rubber
- Appearance: Liquid
- Form: Liquid Rubber
- Item: RTV 160
- Color: Grey
Epoxy Potting Compound for Electronic Components Electronic Components Potting Epoxy Potting Resin
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Black
- Appearance: Black Viscous Liquid (Color-Tunable)
- Density: 1.70-1.85
- Viscosity: 1000-3500
- Glass Transition Temperature: 45-75
Fused Quartz Flour for Glass Manufacturing
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Where to Buy Epoxy Resin Electronic Potting Compound
- CAS No.: 38891-59-7
- Formula: C15h16o2c2h7onc3h5ocl
- EINECS: 231-072-3
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Black
- Appearance: Colorless&Clear
Sp297 Flame Retardant Grade UL94-V0 High-Performance Two-Component Polyurethane Potting Compound for Filling and Sealing of Charging Pile
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Sealing and Potting
- Application: Automobile, Electronics
- Material: Polyurethane
Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin
- CAS No.: 38891-59-7
- Formula: C15h16o2c2h7onc3h5ocl
- EINECS: 231-072-3
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Black
- Appearance: Clear
RTV 160 Grey Electrical Potting Silicone Compound for LED / Circuits Encapsulants
- Raw Material: Synthetic Rubber
- Material: Silicone Rubber
- Appearance: Liquid
- Form: Liquid Rubber
- Item: RTV 160
- Color: a: Grey B: White
5mins 2mins Fast Cured Waterproof Joint Cable Filling Polyurethane Potting Compound
- Material: Epoxy
- Application: Industrial, Motor, Automotive Electronics, Power Tools, Reacto
- Main Raw Material: Polyurethane
- Type: Two Component
- Color: Transparent and Black, Light Yellow
- Hardness: 67sh a / 42sh a
Two-Component Addition Silicone Potting Compound 1: 1 10: 1 Low Hardening Shrinkage Good Waterproof Moisture Proof for Electronics Modules
- Shelf Life: 18 Months
- Produce Capacity: 1000 Tons/Month
- Lead Time: 5-7 Days
- Free Sample: Available
- Packing: Drum
- Port: Shenzhen
Liquid Silicone Compound for Potting & Encapsulating
- Material: Silicone Rubber
- Appearance: Liquid
- Form: Liquid Rubber
- Item: Mcsil-E160
- Color: Grey
- Mixing Ratio: 1:1
Fused Silica Powder -200f
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
Higher Stiffness Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Thermal Insulating Fused Quartz Powder
- Certification: ISO
- Application: Rubber, Ceramic, Casting
- Fused Silica Sand: 0-1mm,1-3mm,3-5mm,4-10mesh,10-20,20-50,50-100mesh
- Fused Silica Powder: -100,-120f,-150L,200f,270f,325mesh
- Fe2o3: <0.003%
- Al2O3: <0.03%
High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting and Encapsulation Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking