1,339 Thermal Potting Compound
results from29 suppliers
Remain Integral Part of The Unit Protect The Electronic Assembly Compound Potting
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Thermally Conductive Epoxy Electrically Insulating Adhesive 1001 Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
High Temperature 1001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Thoughtful Instruction Printed Circuit Boards Potting Compound Thermally Conductive
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Vs-Tp0501 Energy Storage System Silicone Thermally Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
PCB Component Protection and Insulation Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Low Viscosity Self-Leveling Electronic Products Vs-Tp0501 Thermally Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
1: 1 Two Component Thermal Conductive Silicone Electronic Potting Compound
- Color: White or Black Paste
- Material: Silicone, Composite Materials
- Shelf Life: 12 Months
- Quality: 100% Silicone
- Certificate: SGS RoHS
- Application: Solar Module; Solar Panels
Sample Free Black High Thermal Ab Epoxy Potting Compound
- Material: Epoxy
- Application: Industrial, Potting Compund
- Main Raw Material: Epoxy
- Type: Two Component
- Color: White, Black, Grey, Transparent
- Hardness: D75
Remain as Integral Part of The Unit Protect Electronic Assembly Compound Potting
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Sp297 Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Performance PCB Component Thermally Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
OEM Factory Two Component Thermally Conductive Flame Retardant UL 94 V0 Polyurethane Silicone Compound for Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Against Moisture Prevent Short Circuits Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Elastic 2-Part PCB Board Casting Potting Resin Compound for Electronics
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Lower Costs Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Thermally Conductive Flame Retardant Epoxy Potting Compound for Transformer
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Two Component Black Flame Retardant Polyurethane Epoxy Silicone Potting Compound for Motor Electronic Capacitor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
New Product Against Environmental Influences Potting Compound for Electricity
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Low Viscosity Black Flame Retardant Polyurethane Potting Compound for Motor Electronic Capacitor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Black Thermally Conductive Flame Retardant Polyurethane Potting Compound for AC Capacitor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Higher Stiffness Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
OEM Yellow Transparent 2-Part PU Potting Compound for PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
PCB Connection and Fixation in Challenging Environmental Conditions Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Increased Chemical Protection in Complex Assemblies High Thermal Conductivity Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Easy to Operate High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Simple Usage Protection of Power Supply Modules Silicone Thermally Conductive Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Two-Component Compound for Pouring Electronic Circuits
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 25 Shore a
Excellent Drilling Ability Electrical Insulation Epoxy Polyurethane and Silicone Compounds
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Sepna Sp297 100: 15 Black High Volume Resistivity Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Sealing and Potting
- Application: Automobile, Electronics
- Material: Polyurethane
Two Component Thermally Conductive Flame Retardant UL 94 V0 Polyurethane Silicone Compound for EV Chanrger
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Quality Factory Yellow Transparent 2-Part PU Potting Compound for IGBT Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Professional High Quality Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound for EV
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Full Stack Encapsulation Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit Se685/Se686
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Sepna Yellow Transparent 2-Part PU Potting Compound for Home Appliances PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Metal-to-Plastic High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Low Tg Thermally Conductive Flame Retardant Black Two Component Epoxy Potting Compound for Ignition Controller
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Quality Yellow Transparent 2-Part Polyurethane Potting Compound for PCB Box
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking