Basic Info.
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Consumer Electronics
Flame Retardant Properties
V1
Processing Technology
Electrolytic Foil
Insulation Materials
Epoxy Resin
Product Description
PCBA/PCB assembly specifications:
PCB layers: 1 to 36 layers (standard)
PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
Assembly service types: DIP/SMT or mixed SMT and DIP
Copper thickness: 0.5-10oz
Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
PCB dimensions: 450x1500mm
IC pitch (min): 0.2mm
Chip size (min): 0201
Leg distance (min): 0.3mm
BGA sizes: 8x6/55x55mm
SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball diameter: 0.2mm
Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
SMT speed: chip components SMT speed 0.3S/pieces, max speed 0.16S/pieces
What can we do for you?
EMS-electronic manufacturing service
PCB supply and layout
PCB assembly on SMT, BGA and DIP
Cost effective components sourcing
Fast turn prototype and mass production
Box build assembly
Engineering supported
Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)
For PCBA order, provide us:
PCB Gerber file
BOM list for PCBA
Sample of PCB and PCBA
Test method for PCBA
Services and applications:
Through hole board assembly
SMT assembly including BGA assembly, smallest placement: 0201
Material procurement
Consigned material management
Plastic or metal enclosure
Complex final assembly
Functional test
Cable assembly
Labeling and packing
Customized logistics per customer
Laser cut framed SMT solder paste stencils
PCB design and schematic capture
PCBA capabilities:
Component height: 0.2-25mm
Min packing: 0201
Min distance from
BGA: 0.25-2.0mm
Min BGA size: 0.1-0.63mm
Min QFP space: 0.35mm
Min assembly size: 50*30mm
Max assembly size: 350*550mm
Pick-placement precision: 0.01mm
Pick-placement range: QFP, SOP, PLCC, BGA
Placement capability: 0805, 0603, 0402, 0201
High-pin count press fit available
SMT capacity per day: 3,200,000 point
Competitive advantages:
No minimum order quantity and free sample
Focus on low to medium volume production
Quick and on-time delivery
International approvals
Great customer service
Diversified shipping method:
Product description
Item | Mass production | Small batch production |
Number of layers | Up to 36L | Up to 36L |
Laminate type | FR-4, halogen-free, high TG (Shengyi, Jiantao), Cem-3, PTFE, aluminum-based, PTEE, Rogers | FR-4, halogen-free, high TG (Shengyi, Jiantao), Cem-3, PTFE, aluminum-based, PTEE, Rogers |
Maximum board size | 610mm*1100mm | 610mm*1100mm |
Board thickness | 0.1mm-7.00mm | <0.1mm and >7.00mm |
Minimum line width/space | 3.5mil (0.0875mm) | 3mil (0.075mm) |
Minimum line gap | ±15% | ±10% |
Outer layer copper thickness | 35um-175um | 35um-210um |
Inner layer copper thickness | 12um-175um | 12um-210um |
Drilling hole size (mechanical) | 0.15mm-6.5mm | 0.15mm-6.5mm |
Finished hole size (mechanical) | 0.15mm-6.0mm | 0.15mm-6.0mm |
Board thickness hole size ratio | 14:1 | 16:1 |
Board thickness tolerance (t=0.8mm) | ±8% | ±5% |
Board thickness tolerance (t<0.8mm) | ±10% | ±8% |
Min grid line width | 4mil (12, 18, 35um), 6mil (70um) | 4mils (12, 18, 35um), 6mils (70um) |
Min grid spacing | 6mil (12, 18, 35um), 8mil (70um) | 6mils (12, 18, 35um), 8mils (70um) |
Hole size tolerance (mechanical) | 0.05-0.075mm | 0.05mm |
Hole position tolerance (mechanical) | 0.005mm | 0.005mm |
Solder mask color | Green, blue, black, white, yellow, red and grey | Green, blue, black, white, yellow, red and grey |
Impedance control tolerance | ±10% | ±8% |
Min distance between drilling to conductor (non-blind buried orifice) | 8mils (8L), 9mils (10L), 10mils (14L), 12mils (26L) | 6mils (8L), 7mils (10L), 8mils (14L), 12mils (26L) |
Min character width and height (35um base copper) | Line width: 5mils Height: 27mils | Line width: 5mils Height: 27mils |
Max test voltage | 500V | 500V |
Max test current | 200mA | 200mA |
Surface treatment | Flash gold | 0.025-0.075um | 0.025-0.5um |
Immersion gold | 0.05-0.1um | 0.1-0.2um |
Sn/Pb HASL | 1-70um | 1-70um |
Lead-free HASL | 1-70um | 1-70um |
Immersion silver | 0.08-0.3um | 0.08-0.3um |
OSP | 0.2-0.4um | 0.2-0.4um |
Gold finger | 0.375um | ≥1.75um |
Hard gold plating | 0.375um | ≥1.75um |
Immersion sin | 0.8um | |
V-cut rest thickness tolerance | ±0.1mm | ±0.1mm |
Outline profile | Chamfer | Angle type of the chamfer | 30,45,60 |
Plug via hole | Max size can be plugged | 0.6mm |
Largest NPTH hole size | 6.5mm | >6.5mm |
Largest PTH hole size | 6.5mm | >6.5mm |
Min solder spacer ring | 0.05mm | 0.05mm |
Min solder bridge width | 0.1mm | 0.1mm |
Drilling diameter | 0.15mm-0.6mm | 0.15mm-0.6mm |
Min pad diameter with hole | 14mil (0.15mm drilling) | 12mil ( 0.1mm laser) |
Min BGA pad diameter | 10mils | 8mils |
Chemical ENIG gold thickness | 0.025-0.1um (1-4U) | 0.025-0.1um |
Chemical ENIG nickel thickness | 3-5um (120-200U) | 3-5um |
Min-resistance test | Ω | 5 |
sample product description:
all the samples must be made according to the customer's request! Customize PCB!
Address:
Third Floor, B Building, No. 1001, Shangxin Western Industrial Park, Shajin Town, Baoan District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Electrical & Electronics
Management System Certification:
ISO 9001, ISO 14001
Company Introduction:
As one of the high efficient and professional PCB quick service providers in domestic, Shenzhen DFT Technology Co., Ltd. Has been committed to serve for high-tech electronic companies and research institutes at home and abroad. The products-PCB are widely used in communication, automotive electronics, network equipment, industrial control, computer applications, defense military industry, aerospace, medical and other industries, and has been recognized by our customers from all over the world.
Our factory was founded in 2005, with a total investment of 1.6 million dollars, locates in China printed circuit board production center town: , Shajing town-Shenzhen-Guangdong, surrounded by perfect industry ancillary system, convenient transportation, advanced logistics, you can arrive to the global countries from Shenzhen. Since its establishment, with the rapid development of scale, our factory was expanded in June 2013 in order to meet the growing market demand, and currently has a plant area of 10, 000 square meters. D-fit mainly produces high-precision multilayer quick turn sample, small and medium batch boards, multilayer proportion up to 70%, monthly produce up to 15, 000 square meters, and over 6, 000 varieties monthly delivery. Sales offices were established in Beijing, Shanghai and Guangzhou, and gradually estabish export sales department in Nanjing, Wuhan, Chengdu, and is going to develop a comprehensive market at home and abroad.