Specification |
Application: Industrial Ceramic, Electronic Ceramic;
Type: Ceramic Plates;
Lead Time: 30 Days;
Density: 3.33G/Cm^3;
Thermal Conductivity: >180/25ºCw/(Mk);
Dielectric Constant: 8.8/1MHz;
Material: Aluminium Nitride;
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Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Bending Strength: >35MPa;
Dielectric Constant: 3.8 - 4.3;
Resistivity: >1012 Ω M;
Oxidizing Atmosphere: 850°c;
Thermal Conductivity: (40-50)W/M K;
Vacuum and Inertia: 2000&Deg;
Processing Service: Moulding;
Density: 2.25g/cm3;
Compression Strength: >200MPa;
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Application: Aerospace, Electronics, Medical, Refractory, Structure Ceramic;
Type: Ceramic Plates;
Flexural Strength (20ºC): 750-800 MPa;
Thermal Shock Resistance (20ºC): 22 W/M.K;
Vickers Hardness: 14;
Compressive Strength (20ºC): 3000 MPa;
Water Absorption: 0;
Processing Service: Moulding;
Density: 3.24 - 3.26;
Max Working Temperature: 1500ºC;
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Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic;
Type: Ceramic Parts;
Bending Strength: >35MPa;
Dielectric Constant: 3.8 - 4.3;
Resistivity: >1012 Ω M;
Oxidizing Atmosphere: 850°c;
Thermal Conductivity: (40-50)W/M K;
Vacuum and Inertia: 2000°c;
Processing Service: Moulding;
Density: 2.25g/cm3;
Compression Strength: >200MPa;
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Application: Aerospace, Electronics, Medical, Refractory, Electrical Components;
Type: Industrial Parts;
Flexural Strength: 450MPa;
Hardness (Vickers): 11gpa;
Keyword: Aln Substrate;
Color: Grey;
Thermal Conductivity: (25°c) 180 W/Mk;
Processing Service: Moulding;
Density: 3.31g/cm3;
Specific Heat: 750 J/Kg.K;
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