IGBT
US$330.00-360.00 / Piece
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What is FF900r12ie4 High DC Stability Power IGBT Semiconductor with Positive Temperature Coefficient

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

6 Pieces US$330.00-360.00 / Piece

Sepcifications

  • Manufacturing Technology Optoelectronic Semiconductor
  • Material Element Semiconductor
  • Type N-type Semiconductor
  • Package PGA(Pin Grid Array Package)
  • Signal Processing Analog Digital Composite and Function
  • Application Temperature Measurement
  • Model ST
  • Batch Number 2010+
  • Brand Infineon
  • Transport Package Carton
  • Trademark Infineon
  • Origin Germany
  • Configuration Dual
  • IC(Nom) / If(Nom) 900 a
  • Technology IGBT4

Product Description

MODEL: FF600R12IE4 FF900R12IE4 FF900R12IP4 FF1400R12IP4 Infineon PrimePACK™ 2 1200 V, 900 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 Diode, NTC and fast switching chip. Also available with pre-applied Thermal Interface Material. Summary of ...

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IGBT Comparison
Transaction Info
Price US $ 330.00-360.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 6 Pieces 25 Pieces 25 Pieces 25 Pieces 25 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, Xtransfer T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM Own Brand Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: PGA(Pin Grid Array Package);
Signal Processing: Analog Digital Composite and Function;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2010+;
Brand: Infineon;
Configuration: Dual;
IC(Nom) / If(Nom): 900 a;
Technology: IGBT4;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Supplier Name

Shenzhen Botong Electric Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier