Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Cl;
Layer: 24L;
Service: OEM/ODM, EMS;
Support: Fast Proofing;
MOQ: a Slice;
Ten Years: Export Trade Experience;
Sales Model: Factory Direct;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme;
Surface Finishing: HASL, Immersion Gold, OSP;
Application Field: LED, Medical, Industrial, Control Board;
Export Trade: More Than 10 Years;
Lndustry Experience: Over 30 Years;
Business Team Services: 7*24 Hours Online;
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Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCBA: PCBA;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fiberglass;
Insulation Materials: Organic Resin;
PCB: Double-Sided PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fiberglass;
Insulation Materials: Organic Resin;
PCB: Double-Sided PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
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