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What is PCB, HDI, Rigid PCB for Auto

Name: PCB, HDI, Rigid PCB for Auto
Uploaded: 2024-03-25T15:43:31+08:00
Description: Product Description Company Profile TECircuit Electronic and HT Electronic are a group that is an electronics manufacturing service (EMS) provider. Over the past 10+ years, we have gained e

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Price

Min. Order Reference FOB Price

1 Piece US$0.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Complex
Application Consumer Electronics
Flame Retardant Properties HB
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Tecircuit
Transport Package Fob
Specification 86*98mm
Trademark TECircuit
Origin China

Product Description

Product Description Company Profile TECircuit Electronic and HT Electronic are a group that is an electronics manufacturing service (EMS) provider. Over the past 10+ years, we have gained extensive experience in the area of manufacturing and assembling PCB's, allowing us to ...

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Shenzhen Tecircuit Electronic Limited

Gold Member Since 2024

Audited Supplier

Business Range Electrical & Electronics, Packaging & Printing
Main Products Rigid PCB, Flex PCB, HDI PCB, Gold Finger PCB, High Frequency PCB, PCBA, Electronic Components
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
OEM/ODM Availability Yes

PCB Comparison

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Transaction Info
	Quick View PCB, HDI, Rigid PCB for Auto Contact Now	Quick View PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Contact Now	Quick View Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Other PCB PCBA Factory Contact Now	Quick View Car Audio Amplifier Circuit PCB Factory in Shenzhen Contact Now	Quick View OEM PCB PCBA Manufacturer Electronic PCB Circuit Board Production PCBA Assembly Contact Now
Price	US $ 0.99/ Piece	US $ 0.76-5.00/ Piece	US $ 0.78-22.31/ Piece	US $ 0.87-5.00/ Piece	US $ 0.20-20.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	T/T	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	-	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Tecircuit;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Tecircuit Electronic Limited	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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