Specification |
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: SMT Pick and Place Machine;
Dimension(L*D*H): 1650*1690*1485mm;
Placement Speed: 78000cph;
Max. Component Heihgt: H 12mm;
PCB Thickness: 0.38-4.2mm;
Waaranty: 1 Year;
Brand: Samsung;
Numbers of Spindles: 10 Spindles * 2 Gantry;
Usage: SMT Production Line;
Packing: Wooden Case;
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After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
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After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
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Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
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Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 10~7,500 G (Programmable);
Uph: 7000(Max);
X/Y Placement Accuracy: ± 7µm @ 3σ;
Theta Placement Accuracy: ±0.15°@ 3σ;
Bonding Head Heatingtemperatur: up to 350 °c (Optional);
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