Pick and Place Machine
US$150,000.00-200,000.00 / Set
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What is SMT Machine PCB Surface Mount LED PCB Phone Motherboard Assembly Universal Pick and Place Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Set US$150,000.00-200,000.00 / Set

Sepcifications

  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden/Box
  • Specification CE/UL
  • Trademark I. C. T
  • Product Name SMT Pick and Place Machine
  • Dimension(L*D*H) 1650*1690*1485mm
  • Placement Speed 78000cph
  • Max. Component Heihgt H 12mm
  • PCB Thickness 0.38-4.2mm
  • Waaranty 1 Year
  • Brand Samsung
  • Numbers of Spindles 10 Spindles * 2 Gantry
  • Usage SMT Production Line
  • Packing Wooden Case

Product Description

SMT Machine PCB Surface Mount LED PCB Phone Motherboard Assembly Universal Pick and Place Machine Product Description Certifications ...

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Pick and Place Machine Comparison
Transaction Info
Price US $ 150,000.00-200,000.00/ Set US $ 14999/ Set US $ 14999/ Set US $ 100,000.00-200,000.00/ Piece US $ 100,000.00-300,000.00/ Set
Min Order 1 Set 1 Sets 1 Sets 1 Pieces 1 Sets
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T T/T
Quality Control
Product Certification CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr CE CE ISO, CE ISO, CE
Management System Certification ISO 9001, ISO 14000, LEED, ISO 17025 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic
Annual Export Revenue - - - - -
Business Model Own Brand ODM, Own Brand ODM, Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- -
Product Attributes
Specification
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: SMT Pick and Place Machine;
Dimension(L*D*H): 1650*1690*1485mm;
Placement Speed: 78000cph;
Max. Component Heihgt: H 12mm;
PCB Thickness: 0.38-4.2mm;
Waaranty: 1 Year;
Brand: Samsung;
Numbers of Spindles: 10 Spindles * 2 Gantry;
Usage: SMT Production Line;
Packing: Wooden Case;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 10~7,500 G (Programmable);
Uph: 7000(Max);
X/Y Placement Accuracy: ± 7µm @ 3σ;
Theta Placement Accuracy: ±0.15°@ 3σ;
Bonding Head Heatingtemperatur: up to 350 °c (Optional);
Supplier Name

Dongguan ICT Technology Co.,Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier