Multilayer Electronic PCB Board Fabrication and Design

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.26

1,000-4,999 Pieces US$0.23

5,000-9,999 Pieces US$0.19

10,000+ Pieces US$0.16

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate
  • Application Medical Instruments, Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil, Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4, Copper
  • Insulation Materials Epoxy Resin, Organic Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark Fastline
  • Origin Shenzhen, China
  • Type Combining Rigid Circuit Board
  • Mechanical Rigid Rigid
  • Board Thickness 1.6mm
  • Board Layer 4 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Green
  • Silksreen White
  • Surface Finihsing Enig
  • Lead Time 6-8 Working Days

Product Description

-------------------------------------------------------------------------------------------------------------------------------------------- Product Description PCB Capability: Fastline Circuits Co.,Limited PCB Manufacturing Capability Item Manufacture Capability Layers 1-50 Layers ...

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PCB Board Comparison
Transaction Info
Price US $ 0.16-0.26/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier