94V0 Fr4 Circuit Board

US$0.60-0.90 / Piece

PCB Circuits Board Reverse Engineering Without IC pictures & photos

Recommend for you
What is Air Condition Double-Sided PCB with Green Solder Mask
What is Gold Plated Electronic PCB Board for Electronic Machine
What is Customized Asic Circuit for Manufacturer Asic PCB Assembling Electronics-for-Sale

What is PCB Circuits Board Reverse Engineering Without IC

Name: PCB Circuits Board Reverse Engineering Without IC
Uploaded: 2025-05-14T13:33:51+08:00
Description: PCB Circuits Board Reverse Engineering Without IC Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. a

Contact Now

Get Latest Price

About this Item

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Ca
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Thickness 1.6mm
Board Layer 2 Layers
Copper Thickness 1 Oz
Solder Mask Blue
Silksreen White
Min Pad +/- 0.1mm (4mil)
Surface Finihsing HASL-Lf
Lead Time 6-8 Working Days
Shipping Type DHL, UPS, TNT, EMS, FedEx etc
Packing Type Carton + Vacuum
Test Fly Probe Testing
Min Board Thickness 0.1mm Only for Single and Double Sided
Min. Line Width/Space 0.05mm (2mil)
Outline Machining Accuracy +/- 0.1mm (4mil)
MOQ 1 PCS

Product Description

PCB Circuits Board Reverse Engineering Without IC Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single side ...

Learn More

Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

94V0 Fr4 Circuit Board Comparison

	PCB Circuits Board Reverse Engineering Without IC Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Immersion Gold Enig Imm-AG 10layer Circuit Board PCB Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now

Transaction Info
	PCB Circuits Board Reverse Engineering Without IC Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Immersion Gold Enig Imm-AG 10layer Circuit Board PCB Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now
Price	US $ 0.60-0.90/ Piece	US $ 0.223-3.15/ Piece	US $ 0.376-3.89/ Piece	US $ 0.758-4.96/ Piece	US $ 0.912-2.49/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Ca; Board Thickness: 1.6mm; Board Layer: 2 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Min Pad: +/- 0.1mm (4mil); Surface Finihsing: HASL-Lf; Lead Time: 6-8 Working Days; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacuum; Test: Fly Probe Testing; Min Board Thickness: 0.1mm Only for Single and Double Sided; Min. Line Width/Space: 0.05mm (2mil); Outline Machining Accuracy: +/- 0.1mm (4mil); MOQ: 1 PCS;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: HASL-Lf; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;
Supplier Name	Fastline Circuits Co., Limited	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
Select All

Contact Now

Hot Search