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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-998 Pieces US$1.90

999-9,998 Pieces US$0.90

9,999+ Pieces US$0.50

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Carton Box
  • Specification 200pcs/CTN
  • Trademark Customer′ s brand
  • Origin China
  • Board Material Fr4, H-Tg, It-180A, Cem, Aluminum
  • Board Thickness 0.4-5.0mm
  • Solder Mask Color Green, White, Black, Blue, Yellow, Red, Purple
  • Silkscreen Color Green, White, Black, Blue, Yellow
  • Copper Thickness 0.5-10 Oz
  • Layer 1-60 Layers
  • Min. SMD Size 01005
  • Surface Finishing HASL, Lf HASL, Enig, OSP, Carbon Oil
  • Testing E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray
  • MOQ 1PCS
  • Service Turnkey PCB Assembly Service
  • PCBA Test Aoi, in-Circuit Test (Ict), Functioal Test (Fct)
  • PCB Max. Board Size 620*1100mm
  • Certificates UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485

Product Description

About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company ...

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Semi-Finished Products Comparison
Transaction Info
Price US $ 0.50-1.90/ Piece US $ 0.88-0.93/ piece US $ 0.82-2.36/ Piece US $ 0.21-0.32/ piece US $ 7.30-9.50/ Piece
Min Order 1 Pieces 1 piece 1 Pieces 1 piece 1 Pieces
Payment Terms T/T L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million - - - US$10 Million - US$50 Million
Business Model OEM, ODM, IMS service OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Own Brand(KMC)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
PCB Type: PCB Board;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Serive: High Quality;
Structure: Multilayer Rigid PCB, Double-Sided Rigid PCB;
Dielectric: FR-4, Fr-3;
Material: Polyester Glass Fiber Mat Laminate, Phenolic Paper Laminate;
Application: Consumer Electronics, Computer;
Flame Retardant Properties: V0, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process, Semi-Additive Process;
Base Material: Copper, Fr4;
Insulation Materials: Organic Resin, Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 4--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier