Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Turnkey Service: PCB Manufacturing +Purchase Components+Assembly;
Layer: 1-48 Layers;
Solder Mask Color: Green/Black/Red/Blue/Yellow/White/;
Shipping: DHL, FedEx, UPS;
Copper Thickness: 0.5oz-6oz;
Min. Order Quantity: 5 Pieces;
Max. Pth/Npth Size: Pth:6.35mm Npth: 6.35mm;
Min.Hole Size: Pth : 0.1mm Npth : 0.2mm;
Tolerance: +/-0.075mm;
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Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Turnkey Service: PCB Manufacturing +Purchase Components+Assembly;
Layer: 1-48 Layers;
Solder Mask Color: Green/Black/Red/Blue/Yellow/White/;
Shipping: DHL, FedEx, UPS;
Copper Thickness: 0.5oz-6oz;
Min. Order Quantity: 5 Pieces;
Max. Pth/Npth Size: Pth:6.35mm Npth: 6.35mm;
Min.Hole Size: Pth : 0.1mm Npth : 0.2mm;
Tolerance: +/-0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4 Hi Tg;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: Fr4 Hi Tg;
Brand: Shengyi;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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