Multilayer PCB
US$0.50-10.00 / Piece
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What is Customized PCB Integrated Circuit IC PCB Board PCBA Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Green
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 0.21-0.32/ piece US $ 7.30-9.50/ Piece US $ 0.50-2.50/ Piece US $ 0.71-0.90/ Piece
Min Order 1 Pieces 1 piece 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, CCC, ISO, EPA - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million - US$10 Million - US$50 Million US$10 Million - US$50 Million -
Business Model OEM, ODM, Own Brand() OEM, ODM OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC) OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB, Double-Sided Rigid PCB;
Dielectric: FR-4, Fr-3;
Material: Polyester Glass Fiber Mat Laminate, Phenolic Paper Laminate;
Application: Consumer Electronics, Computer;
Flame Retardant Properties: V0, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process, Semi-Additive Process;
Base Material: Copper, Fr4;
Insulation Materials: Organic Resin, Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 4--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Model: Fr-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Supplier Name

Usun Electronics Limited.,

Gold Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier