PCB Board
US$0.70-3.10 / Piece
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What is Cheap Price V0 OEM ODM Customizable Shenzhen Custom Assembly Fabricator PCB Circuit

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$3.10

100+ Pieces US$0.70

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics
  • Transport Package Strong and Secure/Plastic Bag/Foam Bag/Vacuum Pack
  • Specification Customizable
  • Trademark KING FIELD
  • Origin Shenzhen
  • MOQ No
  • Service OEM ODM
  • Certification RoHS, UL CE, GS, ISO
  • Keyword PCB

Product Description

Quick response, will reply Customer's any enquiry within 1 hours -24 hours technique Support. -24 hours Engineering Gerber files treatment. -24 hours English Engineering Questions Confirmation by E-mail. -ExperiencedImpedance Designer. -Supply the best project fit for production customized. ...

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PCB Board Comparison
Transaction Info
Price US $ 0.70-3.10/ Piece US $ 0.01-10.00/ Piece US $ 0.01-100.00/ Piece US $ 0.50-5.50/ Piece US $ 0.10-80.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, WeChat/Alipay L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - UL, ISO9001&ISO14001, SGS, RoHS,Ts16949
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM, Own Brand OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
MOQ: No;
Service: OEM ODM;
Keyword: PCB;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Industry Area;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: Lead Free HASL, Immersion Gold(Enig), Immersion SL;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V2;
Application: Consumer Electronics;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Special Process: Stiffeners etc;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Brand: Abis;
Supplier Name

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

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Abis Circuits Co., Ltd.

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Keep Moving Circuits Co., Ltd.

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Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier