HDI PCB Structure
US$0.10-10.00 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Sy Fr4
  • Insulation Materials Organic Resin
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
  • Copper Weights 0.5oz~10oz
  • Layer Count 1-64 Layers
  • Stack up Control Dielectric/Control Impedance/Tdr Testing
  • Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
  • Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
  • Stack Via 5step
  • Stagger Via 5step
  • Laser Via Hole Size 0.1mm
  • Filling Via Dimple Value <=15um
  • Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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HDI PCB Structure Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.10-20.00/ Square Meter US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 1 Square Meters 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, XT Online transactions L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification - - ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand - OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fiberglass;
Insulation Materials: Organic Resin;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier