Flex Circuit PCB
US$0.99-9.99 / Piece
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What is Shenzhen Supplier Turnkey Service Assembly Medical Device Used 4 Layers Pi Flexible Circuit Board Multilayer Rigid FPC

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.99-9.99 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics
  • Transport Package Strong and Secure/Plastic Bag/Foam Bag/Vacuum Pack
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Layers 32 Layers
  • Min Track / Spacing 0.075 mm / 0.075 mm
  • Min Hole Size 0.10 mm
  • Min Pad Size 0.35 mm
  • Rigid-Flex Thickness 0.25 mm-6.0 mm
  • Max Copper Thickness 5 Oz
  • Max Wpnl Size 610 mm X 914 mm
  • Finish Copper(Flex Part) 0.5-2 Oz
  • Finish Copper(Rigid Part) 1-5 Oz
  • Surface Finish Enig, OSP, Immersion Silver, HASL, Caborn, Enepig
  • Drilling Accuracy +/-0.05 mm

Product Description

Rigid Flex PCB Capabilities Item Capability Layers 32 Layers Min Track / Spacing 0.075 mm / 0.075 mm Min Hole Size / Pad Size 0.10 mm / 0.35 mm Rigid-Flex Thickness 0.25 mm-6.0 mm Max Copper Thickness 5oz Max WPNL Size 610 mm X 914 mm Finish Copper(Flex Part) 0.5-2 oz Finish ...

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Flex Circuit PCB Comparison
Transaction Info
Price US $ 0.99-9.99/ Piece US $ 0.01-20.00/ Piece US $ 0.01-20.00/ Piece US $ 0.10-80.00/ piece US $ 0.01/ piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 piece 1 piece
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, D/P, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layers: 32 Layers;
Min Track / Spacing: 0.075 mm / 0.075 mm;
Min Hole Size: 0.10 mm;
Min Pad Size: 0.35 mm;
Rigid-Flex Thickness: 0.25 mm-6.0 mm;
Max Copper Thickness: 5 Oz;
Max Wpnl Size: 610 mm X 914 mm;
Finish Copper(Flex Part): 0.5-2 Oz;
Finish Copper(Rigid Part): 1-5 Oz;
Surface Finish: Enig, OSP, Immersion Silver, HASL, Caborn, Enepig;
Drilling Accuracy: +/-0.05 mm;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: Consumer Electronics;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Used in: Automotive, Aerospace, Digital, Computer, LED, etc;
Solder Mask: N/a;
Max Copper: 6 Oz;
Min Thickness: 0.15 mm;
Max Layer: 8 Layer;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier