HDI 3 Components

US$0.10-10.00 / Piece

View

High Precision Multilayer Printed Circuit Boards Blind and Buried Via Tg170 180 Flexible Multilayer Circuit Board pictures & photos

Recommend for you
What is Specialized 2oz 3oz Customized High Frequency PCB Circuit Board Rogers PCB Factory with Gold Plating Finger
What is Local Power 120 Micro Inches Shenjin Power Surface Finish High Frequency 3 Step HDI Multilayer PCB Coil for Industrial Device
What is OEM High Quality Fr4 94V0 CCTV Board Camera Module Assembly 0.5-3.2mm Thickness Copper 1oz-4oz 4 Layer Rogers Printed Circuit Board

What is High Precision Multilayer Printed Circuit Boards Blind and Buried Via Tg170 180 Flexible Multilayer Circuit Board

Name: High Precision Multilayer Printed Circuit Boards Blind and Buried Via Tg170 180 Flexible Multilayer Circuit Board
Uploaded: 2024-05-08T20:17:27+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

Learn More

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI 3 Components Comparison

	Quick View High Precision Multilayer Printed Circuit Boards Blind and Buried Via Tg170 180 Flexible Multilayer Circuit Board Contact Now	Quick View PCB Fabrication Rigid-Flex Print Circuit Board PCB Manufacturer Contact Now	Quick View Quick Turn PCB Board Manufacturer Rigid-Flex PCB Factory Contact Now	Quick View Rigid-Flexible PCB Boards Manufacturer FPC Board Flex Board Contact Now	Quick View Four Multilayer PCB with Immersion Gold for Communication Contact Now

Transaction Info
	Quick View High Precision Multilayer Printed Circuit Boards Blind and Buried Via Tg170 180 Flexible Multilayer Circuit Board Contact Now	Quick View PCB Fabrication Rigid-Flex Print Circuit Board PCB Manufacturer Contact Now	Quick View Quick Turn PCB Board Manufacturer Rigid-Flex PCB Factory Contact Now	Quick View Rigid-Flexible PCB Boards Manufacturer FPC Board Flex Board Contact Now	Quick View Four Multilayer PCB with Immersion Gold for Communication Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 3.91-3.92/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	T/T	T/T	T/T	T/T
Quality Control
Management System Certification	-	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Mid East, Western Europe	North America, Eastern Europe, Mid East, Western Europe	North America, Eastern Europe, Mid East, Western Europe	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Max Layer Counts: 6 Layer; Max Copper Thickness: 2oz; Mininum Line Width: 3mil; Minimum Line Space: 3mil; UL Certificate: Yes; Sample Building: Yes; Quickturn Service: Yes; Country of Origin: China; Packing: Vacuum Packing;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Max Layer Counts: 6 Layer; Max Copper Thickness: 2oz; Mininum Line Width: 3mil; Minimum Line Space: 3mil; UL Certificate: Yes; Sample Building: Yes; Quickturn Service: Yes; Country of Origin: China; Packing: Vacuum Packing;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Max Layer Counts: 6 Layer; Max Copper Thickness: 2oz; Mininum Line Width: 3mil; Minimum Line Space: 3mil; UL Certificate: Yes; Sample Building: Yes; Quickturn Service: Yes; Country of Origin: China; Packing: Vacuum Packing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Greenstone Technology Limited	Shenzhen Greenstone Technology Limited	Shenzhen Greenstone Technology Limited	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
Select All

Contact Now

Hot Search