Ca-033 Micro Type-C USB 5V Charging Board with Protection Dual Functions 1A Li-ion Lithium Battery Charger Module 18650 Tp4056 pictures & photos

Ca-033 Micro Type-C USB 5V Charging Board with Protection Dual Functions 1A Li-ion Lithium Battery Charger Module 18650 Tp4056

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

2 Pieces US$0.85-2.89 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Vacuum Packaging, Carton Box
Specification FR-4 SILICON COMPONENTS
Trademark New Chip
Origin China
Layer 1-32 Layers
Service OEM/ODM
OEM/ODM Available
Test 100%E-Testing
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea
Surface Treatmen OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes

Product Description

Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

Learn More

Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

	Ca-033 Micro Type-C USB 5V Charging Board with Protection Dual Functions 1A Li-ion Lithium Battery Charger Module 18650 Tp4056 Contact Now	Quick View Shenzhen High Quality 94V0 RoHS Edge Plating Green Soldermask Fr-4 HDI Technology in PCB for Casio Calculator Contact Now	Quick View OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design Contact Now	Quick View OEM Small Size Multilayer High Precision Assembly Service PCBA Manufacture HDD Donor PCB with Provided Gerber Contact Now	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now

Transaction Info
	Ca-033 Micro Type-C USB 5V Charging Board with Protection Dual Functions 1A Li-ion Lithium Battery Charger Module 18650 Tp4056 Contact Now	Quick View Shenzhen High Quality 94V0 RoHS Edge Plating Green Soldermask Fr-4 HDI Technology in PCB for Casio Calculator Contact Now	Quick View OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design Contact Now	Quick View OEM Small Size Multilayer High Precision Assembly Service PCBA Manufacture HDD Donor PCB with Provided Gerber Contact Now	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now
Price	US $ 0.85-2.89/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	2 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, D/P, Western Union	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	ISO 9001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million
Business Model	OEM, ODM	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
Select All

Contact Now

Hot Search