PCB Assembly

US$0.10-5.00 / Piece

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What is PS High Frequency Printed Circuit Board Fabrication Multilayer PCB

Name: PS High Frequency Printed Circuit Board Fabrication Multilayer PCB
Uploaded: 2024-01-22T11:53:01+08:00
Description: PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand PS
Transport Package Box
Specification <1500mm
Trademark PS Electronics
Origin China
Quality Test Aoi, 100% E-Test
V- Cut Tolerance +-10mi
Bevel Edge +-5mil
Hole Location Tolerance +-2mil
Hole Diameter Tolerance +-0.05mm
Board Thickness Tolerance +-5%
Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or ...

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Ps Electronics Co., Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCBA, PCB Assembly, High Frequency PCB, Multilayer PCB, FPC PCB, Rigid-Flex PCB, LED PCB, Copper PCB, Aluminum PCB
Plant Area 501~1000 square meters
Management System Certification ISO 9001, ISO 14001
Main Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months

PCB Assembly Comparison

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Transaction Info
	Quick View PS High Frequency Printed Circuit Board Fabrication Multilayer PCB Contact Now	Quick View Circuits Board PCBA Hot Swap Wireless Mechanical Keyboard PCB Contact Now	Quick View Tele-Communicate Electronics Assembly Bom Gerber Files Multilayer PCB PCBA Assembly Contact Now	Quick View One Stop PCB Manufacture Printed Circuit Board Box Building Customization Multilayer PCB Assembly for Medical Products Contact Now	Quick View PCBA EMS Supplier 94V0 Circuitboard SMT&DIP PCBA Board Assembly Contact Now
Price	US $ 0.10-5.00/ Piece	US $ 0.01-150.00/ Piece	US $ 0.51-3.00/ Piece	US $ 0.56-5.00/ Piece	US $ 0.87-5.00/ Piece
Min Order	1 Pieces	1 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	T/T	T/T	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 3-6 Month(s) Peak-season: 3-6 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: PS; Quality Test: Aoi, 100% E-Test; V- Cut Tolerance: +-10mi; Bevel Edge: +-5mil; Hole Location Tolerance: +-2mil; Hole Diameter Tolerance: +-0.05mm; Board Thickness Tolerance: +-5%; Line Width/Space Tolerance: +-10%;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Remark: PCB Board; Layer: 8; Surface Finish: HASL; Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers; Board Thickness: 0.20mm-8.00mm; Min Line: 0.075mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Ps Electronics Co., Ltd	Abis Circuits Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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