138 BGA Paste

US$30.00-80.00 / kg

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Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing pictures & photos

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What is Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing

Name: Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing
Uploaded: 2023-11-21T16:56:36+08:00
Description: Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing We produce differenty types of solder paste: Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5

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About this Item

Price

Min. Order Reference FOB Price

30 kg US$30.00-80.00 / kg

Sepcifications

state Liquid
pH Neutral
Type Solder Paste
Melting Point <200℃
Chemical Composition Sn-Bi
Function Make the Liquid Solder Flow
Application SMT
Manufacturing Method Smelting
Transport Package Foam Box
Specification 100g to 1000g
Trademark XF Solder
Origin China
Alloy Lead Free
Powder Size Type 3: 25 to 45 Microns
Powder Size 2 Type 4: 20 to 38 Microns
Flux No Clean Flux
Alloy 2 Sac305 Sn96.5AG3.0cu0.5
Alloy 3 Sac0307 Sn99AG0.3cu0.7
Alloy 4 Sn42bi58 Low Temperature
Certificate RoHS
Packing Jar
Packing 2 Syringe
Shipping Courier / Air Freight
Shelf Life 6months
Storage 0 to 10 Degree Celsius
Application 2 SMD

Product Description

Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing We produce differenty types of solder paste: Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc ...

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Foshan Xi Feng Tin Products Co., Ltd.

Gold Member Since 2018

Audited Supplier

Business Type Manufacturer/Factory
Main Products Solder Wire, Solder Bar
Number of Employees 10
Year of Establishment 2013-02-26
Management System Certification ISO 9001, ISO 14001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

138 BGA Paste Comparison

	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Syringe Flux for Mobile Phone Repair and Welding Contact Now	Quick View High-Quality Lead-Free Solder Paste Sn96.5AG3cu0.5 Alloy Eco-Friendly Welding Contact Now	Quick View Lead-Free Solder Paste for an Upgrade Sn96.5AG3cu0.5 Alloy Efficient and Reliable Contact Now	Quick View Complete Automatic Soldering Paste Printer Contact Now

Transaction Info
	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Syringe Flux for Mobile Phone Repair and Welding Contact Now	Quick View High-Quality Lead-Free Solder Paste Sn96.5AG3cu0.5 Alloy Eco-Friendly Welding Contact Now	Quick View Lead-Free Solder Paste for an Upgrade Sn96.5AG3cu0.5 Alloy Efficient and Reliable Contact Now	Quick View Complete Automatic Soldering Paste Printer Contact Now
Price	US $ 30.00-80.00/ kg	US $ 1.80-3.80/ Piece	US $ 69.30-75.30/ kg	US $ 69.30-75.30/ kg	US $ 3,000.00-9,500.00/ Piece
Min Order	30 kg	100 Pieces	100 kg	100 kg	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal, Money Gram	T/T	T/T	T/T	L/C, T/T, D/P
Quality Control
Product Certification	RoHS	-	-	-	-
Management System Certification	ISO 9001, ISO 14001	ISO 9001	ISO 9001	ISO 9001	ISO 14001
Trade Capacity
Export Markets	South America, Europe, Southeast Asia/ Mideast, Domestic	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM	OEM	OEM	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: SMD;	state: Solid; pH: Neutral; Type: Inorganic; Melting Point: 301℃-400℃; Chemical Composition: Rosin Paste; Function: Remove Oxides; Application: Submerged-arc Welding; Manufacturing Method: Smelting; Ingredients: Rosin; Cleaning Angle: No Cleaning; Halogen Content: ND; Application Scenario: BGA/Repair;	state: Solid; pH: Neutral; Type: Inorganic; Melting Point: 200℃-300℃; Chemical Composition: Snagcu; Function: Remove Oxides; Application: Electroslag Welding; Manufacturing Method: Smelting; Composition: Sn96.5AG3cu0.5; Features: Continuous Printing for 72 Hours; Properties: Good Anti-Oxidation; Weight: 500g; Particles: T3/T4;	state: Solid; pH: Neutral; Type: Inorganic; Melting Point: 200℃-300℃; Chemical Composition: Snagcu; Function: Remove Oxides; Application: Electroslag Welding; Manufacturing Method: Smelting;	Type: Dry/Wet/Vacuum, Programmable Screen Cleaning; Application Industry: SMT PCB Material Solder Paste Printing; Printing Deviation: up/Down Vision Accurate Alignmnet System to Ensure; Programmable Screen Cleaning System: Available; Visual Precision Positioning: Available; Programmable Floating Print Head: Available; Ensure PCB Is Flat Without Bending: Available; PCB Thickness: Adapt to PCB with Different Thickness;
Supplier Name	Foshan Xi Feng Tin Products Co., Ltd.	DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD	DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD	DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD	Guangdong Moje Intelligent Equipment Co., Ltd.
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