Specification |
Application: Aerospace, Electronics, Medical, IGBT, Powe Modules, Electronics;
Type: Ceramic Parts;
Flexural Strength: 450MPa;
Surface Roughness: 0.3-0.6;
Color: Light Grey;
Dielectric Constant: 8-10;
Dimension: Customized;
Thermal Conductivity: >(25°c) 170 W/Mk;
Processing Service: Moulding;
Density: >3.33G/Cm3;
Feature: High Thermal Conductivity;
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Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Material: Hot Pressed Boron Nitride;
Density: 1.5-2.9 g/cm3;
Color: White, Light Grey, Dark Grey;
Thermal Conductivity: 30-85 W/M.K;
Max Working Temperature (in Air): 1000 C;
Max Working Temperature (in Vacuum): 1800 C;
Max Working Temperature (in Inert Gas): 2100 C;
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Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Material: Hot Pressed Boron Nitride;
Density: 1.5-2.9 g/cm3;
Color: White, Light Grey, Dark Grey;
Thermal Conductivity: 30-85 W/M.K;
Max Working Temperature (in Air): 1000 C;
Max Working Temperature (in Vacuum): 1800 C;
Max Working Temperature (in Inert Gas): 2100 C;
|
Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Material: Hot Pressed Boron Nitride;
Density: 1.5-2.9 g/cm3;
Color: White, Light Grey, Dark Grey;
Thermal Conductivity: 30-85 W/M.K;
Max Working Temperature (in Air): 1000 C;
Max Working Temperature (in Vacuum): 1800 C;
Max Working Temperature (in Inert Gas): 2100 C;
|
Application: Aerospace, Electronics, Medical, Refractory;
Type: Ceramic Part;
Material: Hot Pressed Boron Nitride;
Density: 1.5-2.9 g/cm3;
Color: White, Light Grey, Dark Grey;
Thermal Conductivity: 30-85 W/M.K;
Max Working Temperature (in Air): 1000 C;
Max Working Temperature (in Vacuum): 1800 C;
Max Working Temperature (in Inert Gas): 2100 C;
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